in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751Platinum-chip temperature sensors SMDFCB-L-AuNi

Platinum chip temperature sensors belong to the category of temperature sensors that were made using thin-film technology. Sensors of the SMDFCB design type have a single-sided contact (flip chip) and are equipped with a solderable nickel-gold metallization on the back cover. The metal layer enables direct thermal contact with another body via a solder connection.

in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751 Platinum-chip temperature sensors SMDFCB-L-AuNi

Platinum-chip temperature sensors SMDFCB-L-AuNi - in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751

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in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751

Platinum-chip temperature sensors SMDFCB-L-AuNi

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in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751Platinum-chip temperature sensors SMDFCB-L-AuNi

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